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1 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
2 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bonding
- TC bird beak bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bonding -
3 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bird beak bonding
- TC bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bondingThe New English-Russian Dictionary of Radio-electronics > bonding
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4 wedge bonding
English-German dictionary of Electrical Engineering and Electronics > wedge bonding
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5 wedge
<tech.gen> ■ Keil mvt <tech.gen> (with wedges; e.g. frames, doors, cargo) ■ verkeilen vt -
6 wedge bonding
1) Микроэлектроника: термокомпрессионная сварка клинообразным пуансоном -
7 wedge bonding
<el> ■ Keilbonden n< join> ■ Schneidenbondverfahren n -
8 wedge bonding
термокомпресійне зварювання клиноподібним пуансономEnglish-Ukrainian dictionary of microelectronics > wedge bonding
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9 wedge bonding
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10 wedge bonding
The New English-Russian Dictionary of Radio-electronics > wedge bonding
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11 wedge bonding
• kiilaliitosmenetelmä -
12 wedge bonding
połączenie termokompresyjne metodą ostrzową -
13 wedge bonding
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14 Ball-Wedge-Verfahren
nsg <el.ic.prod> ■ ball bonding; ball-wedge bonding -
15 bond wedge
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16 ball-wedge bonding
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17 ball bonding
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18 back radius
(BR) <el.ic.prod> (bonding wedge) ■ hinterer Radius m -
19 BR
<el.ic.prod> (bonding wedge) ■ hinterer Radius m< plast> ■ Butadienkautschuk m -
20 FR
<el.ic.prod> (bonding wedge) ■ Frontradius m
- 1
- 2
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